Millimeter-wave IC packaging technology-state of the art and future trends

Ohata, Keiichi (2000) Millimeter-wave IC packaging technology-state of the art and future trends. In: Gallium Arsenide applications symposium. GAAS 2000, 2-6 october 2000, Paris.
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Abstract

This paper presents an overview of recent state of the art technologies and future trends in millimeter-wave MMIC packaging in the aspects of low cost, high productivity and high functionality. Developments of ceramic packages up to W-band have been progressed by design innovation. LTCC Technology with thick film printing has realized low-cost packages and 60GHz-band antenna integrated MCMs. Multi-junctional integrated modules have been proposed utilizing Si micromachining technologies.

Abstract
Tipologia del documento
Documento relativo ad un convegno o altro evento (Atto)
Autori
AutoreAffiliazioneORCID
Ohata, Keiichi
Settori scientifico-disciplinari
Area 09 - Ingegneria industriale e dell'informazione > ING-INF/01 Elettronica
DOI
10.6092/unibo/amsacta/249
Data di deposito
17 Giu 2004
Ultima modifica
17 Feb 2016 13:42
URI
https://amsacta.unibo.it/id/eprint/249

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