Development of Highly Integrated 3D Microwave - Millimeter Wave Radio Front-End System-on-Package (SOP)

Tentzeris, M. ; Laskar, J. ; Sutono, A. ; Lee, C.–H. ; Davis, M.F. ; Obatoyinbo, A. ; Lim, K. (2001) Development of Highly Integrated 3D Microwave - Millimeter Wave Radio Front-End System-on-Package (SOP). In: Gallium Arsenide applications symposium. Gaas 2001, 24-28 September 2001, London.
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Abstract

We present the development, implementation and measurement of a 3D-deployed RF front-end System-on-Package (SOP) topology in a standard low-loss multi-layer ceramic (LTCC) technology. A compact 14 GHz GaAs MESFET-based satellite transmitter integrated with a low-loss embedded filter for outdoor units were built on a 400 × 310 × 35.2 mil 3 943AT tapes. The LTCC stripline filter exhibits a measured maximum insertion loss of 1.8 dB while the entire transmitter chain yields a 32-34 dB of gain in the 13.5 to 14.5 GHz range. These results suggest the feasibility of building highly SOP integrated microwave and millimeter wave radio front ends. In addition, a highly integrated transceiver module for OFDM Communication System using Multilayer Packaging technology as well as Multilayer Integrated Passives using Fully Organic SOP technology demonstrate the capabilities of SOP for other applications such as the OFDM Wireless LAN and LMDS.

Abstract
Tipologia del documento
Documento relativo ad un convegno o altro evento (Atto)
Autori
AutoreAffiliazioneORCID
Tentzeris, M.
Laskar, J.
Sutono, A.
Lee, C.–H.
Davis, M.F.
Obatoyinbo, A.
Lim, K.
Settori scientifico-disciplinari
DOI
Data di deposito
17 Giu 2004
Ultima modifica
17 Feb 2016 13:35
URI

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