60GHZ-band flip-chip MMIC modules for IEEE1394 wireless adapters

Maruhashi, K. ; Ito, M. ; Ikuina, K. ; Hashiguchi, T. ; Matsuda, J. ; Domon, W. ; Iwanaga, S. ; Takahashi, N. ; Ishihara, T. ; Yoshida, Y. ; Izumi, I. ; Ohata, K. (2001) 60GHZ-band flip-chip MMIC modules for IEEE1394 wireless adapters. In: Gallium Arsenide applications symposium. GAAS 2001, 24-28 september 2001, London.
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Abstract

60GHz-band 500-Mpbs transmitter and receiver multi-chip modules (MCMs) are presented, in which MMICs and a filter are mounted using flip-chip bonding technique. A multi-layer Low Temperature Co-fired Ceramic (LTCC) substrate is adopted for a package. The MCMs are directly bonded with printed wiring boards using ball grid array technique, achieving connections for signals and biasing. A developed 500-Mbps ASK transceiver exhibits an average output power of 10dBm and a minimum received power of – 55dBm. The transceiver is applied to the IEEE1394 wireless adapter which demonstrates 17-m communication distance in line of sight.

Abstract
Tipologia del documento
Documento relativo ad un convegno o altro evento (Atto)
Autori
AutoreAffiliazioneORCID
Maruhashi, K.
Ito, M.
Ikuina, K.
Hashiguchi, T.
Matsuda, J.
Domon, W.
Iwanaga, S.
Takahashi, N.
Ishihara, T.
Yoshida, Y.
Izumi, I.
Ohata, K.
Settori scientifico-disciplinari
DOI
Data di deposito
17 Giu 2004
Ultima modifica
17 Feb 2016 13:47
URI

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