Novel Organic SMD Package for High-Power Millimeter Wave MMICs

Van Heijningen, M. ; Priday, J. (2004) Novel Organic SMD Package for High-Power Millimeter Wave MMICs. In: Gallium Arsenide applications symposium. GAAS 2004, 11—12 Ottobre, Amsterdam.
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Abstract

In this paper a novel low-cost SMD package for high-power MMICs is presented. Due to the special design this package has a very low thermal resistance and low parasitic ground inductance. 3D EM simulations of a packaged through-line correspond well with measurements. Measurement results of a 1 Watt 40 GHz HPA before and after packaging are presented. The gain reduction at 40 GHz caused by the package is only 1 dB. Experimental results are given for different package options: with or without compensation circuit on the package and with or without bondwire compensation on the MMIC.

Abstract
Tipologia del documento
Documento relativo ad un convegno o altro evento (Atto)
Autori
AutoreAffiliazioneORCID
Van Heijningen, M.
Priday, J.
Settori scientifico-disciplinari
DOI
Data di deposito
15 Giu 2005
Ultima modifica
17 Feb 2016 14:09
URI

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