A novel package approach for multichip modules based on anisotropic conductive adhesives

Heyen, Johann ; Jacob, Arne F. (2005) A novel package approach for multichip modules based on anisotropic conductive adhesives. In: Gallium Arsenide applications symposium. GAAS 2005, 3-7 ottobre 2005, Parigi.
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Abstract

In this paper anisotropic conductive pastes (ACP) are proposed for different level interconnections of millimeter-wave multichip modules (MCM) and packages. A novel ACP-based approach for cavity-up millimeter-wave packages simultaneously featuring small size, electrical and mechanical interconnection as well as heat transfer capabili-ties is presented.

Abstract
Document type
Conference or Workshop Item (Paper)
Creators
CreatorsAffiliationORCID
Heyen, Johann
Jacob, Arne F.
Subjects
DOI
Deposit date
15 Feb 2006
Last modified
17 Feb 2016 14:24
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