Three-dimensional packaging technologies for highly integrated T/R modules

Deborgies, F. ; Lemoine, Thierry ; Mancuso, Yves (1999) Three-dimensional packaging technologies for highly integrated T/R modules. In: Gallium Arsenide Applications Symposium. GAAS 1999, 4-5 October 1999, Bologna, Italy.

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Abstract

Future generations of avionic systems will be based on conformal antennas spread over the body of the aircraft. Smart skin systems will need highly integrated T/R modules (size below 2 cm2 at 10 GHz). To realise these modules, 3D integration of MMICs and control circuits is proposed.

Abstract

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