Abstract

In this paper a novel low-cost SMD package for high-power MMICs is presented. Due to the special design this package has a very low thermal resistance and low parasitic ground inductance. 3D EM simulations of a packaged through-line correspond well with measurements. Measurement results of a 1 Watt 40 GHz HPA before and after packaging are presented. The gain reduction at 40 GHz caused by the package is only 1 dB. Experimental results are given for different package options: with or without compensation circuit on the package and with or without bondwire compensation on the MMIC.