Design of novel multilayer microwave coupled-line structures using thick-film technology

Tian, Zhengrong ; Free, Charles ; Barnwell, Peter ; Wood, James ; Aitchison, Colin (2001) Design of novel multilayer microwave coupled-line structures using thick-film technology. In: Gallium Arsenide applications symposium. GAAS 2001, 24-28 september 2001, London.
Full text disponibile come:
[thumbnail of Eug_6_2.pdf]
Anteprima
Documento PDF
Download (186kB) | Anteprima

Abstract

A novel octave band DC block (2.5 -10.5GHz) and a broadband 3dB directional coupler (3-8GHz) have been designed, fabricated and tested using a new multilayer format. The multiple layers of thick-film dielectric and metal were printed on an alumina base and an etching technique used to form the final conductor pattern. The tight coupling required between the coupled lines was realized by overlapping these lines in a multilayer structure. Very good agreement was obtained between measured and simulated data. The results demonstrate that multilayer thick-film techniques provide an efficient method of achieving small size, low cost components having good microwave performance. In particular, the new multilayer approach has been shown to overcome the problem of fabricating very small gaps between coupled lines in a traditional single layer structure.

Abstract
Tipologia del documento
Documento relativo ad un convegno o altro evento (Atto)
Autori
AutoreAffiliazioneORCID
Tian, Zhengrong
Free, Charles
Barnwell, Peter
Wood, James
Aitchison, Colin
Settori scientifico-disciplinari
DOI
Data di deposito
17 Giu 2004
Ultima modifica
17 Feb 2016 13:47
URI

Altri metadati

Statistica sui download

Statistica sui download

Gestione del documento: Visualizza il documento

^