Abstract

A comparison between flip-chip mounting of monolithic microwave integrated circuits (MMICs) in microstrip transmission line technology and coplanar transmission line technology is presented. The influence of substrate proximity effects on the electrical behavior of the MMICs is examined and illustrated innormalized frequency independent graphs. Based on the esults of this work, the performance of microstrip-MMICs used in flip-chip configuration can be estimated as a function of the chosen assembly geometry.