Spice Thermal Subcircuit of Multifinger HBT derived from Ritz Vector reduction technique of 3D Thermal Simulation for electrothermal modeling

Lopez, D. ; Sommet, R. ; Quéré, R. (2001) Spice Thermal Subcircuit of Multifinger HBT derived from Ritz Vector reduction technique of 3D Thermal Simulation for electrothermal modeling. In: Gallium Arsenide applications symposium. Gaas 2001, 24-28 September 2001, London.
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Abstract

This paper deals with the integration of a reduced thermal model based on tree dimensional Finite Element (FE) thermal simulation into circuit simulator for accurate prediction of electrothermal behavior of power devices. The reduced thermal model based on the Ritz vectors approach is easily usable in any kind of circuit simulator because it is described by a spice format subcircuit. The model has been successfully experimented with the ADS simulator. Electrical based thermal measurements of transient temperature response have successfully validated our approach.

Abstract
Tipologia del documento
Documento relativo ad un convegno o altro evento (Atto)
Autori
AutoreAffiliazioneORCID
Lopez, D.
Sommet, R.
Quéré, R.
Settori scientifico-disciplinari
DOI
Data di deposito
17 Giu 2004
Ultima modifica
17 Feb 2016 13:35
URI

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