A low-cost high performance GaAs MMIC package using air-cavity ceramic quad flat non-leaded package up to 40 GHz

Suh, Young-Ho ; Richardson, David ; Dadello, Anna ; Mahon, Simon ; Harvey, James T. (2005) A low-cost high performance GaAs MMIC package using air-cavity ceramic quad flat non-leaded package up to 40 GHz. In: Gallium Arsenide applications symposium. GAAS 2005, 3-7 ottobre 2005, Parigi.
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Abstract

A novel low-cost QFN (Quad Flat Non-Leaded) package is introduced for GaAs MMIC packaging. The air-cavity QFN package is designed and implemented with an HTCC process using Alumina substrate. To operate the package up to 40 GHz, several key methods are proposed in this paper. A low noise and a buffer amplifier are packaged for practical application examples and compared with bare die measurements to verify the QFN package performance. A maximum of 4.5 dB insertion loss degradation occurred at 40 GHz. To authors’ knowledge, this is the highest operating frequency for QFN type packages with low loss ever reported.

Abstract
Document type
Conference or Workshop Item (Paper)
Creators
CreatorsAffiliationORCID
Suh, Young-Ho
Richardson, David
Dadello, Anna
Mahon, Simon
Harvey, James T.
Subjects
DOI
Deposit date
15 Feb 2006
Last modified
17 Feb 2016 14:24
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