Deborgies, F. ; Lemoine, Thierry ; Mancuso, Yves
(1999)
Three-dimensional packaging technologies for highly integrated T/R modules.
In: Gallium Arsenide Applications Symposium. GAAS 1999, 4-5 October 1999, Bologna, Italy.
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Abstract
Future generations of avionic systems will be based on conformal antennas spread over the body of the aircraft. Smart skin systems will need highly integrated T/R modules (size below 2 cm2 at 10 GHz). To realise these modules, 3D integration of MMICs and control circuits is proposed.
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