Abstract

Semiconductor technology has made significant advancements in the past few decades. High frequency devices, including GaAs, HEMT, and HBT are driven into the market. At the same time, the demand of packages for high frequency devices are accelerating to the market. The movement for package-less by passivation layer is occuring, however because the device yield is poor, high frequency packages are highly demanded. These packages are currently being required for such applications in car radar and wireless LAN programs. This paper will describe the design technologies and material options of micro- to millimeter-wave MMIC package for the consumer market to meet the demands for a small, low cost, and high performance package.