Development of millimeter-wave package for consumer market

Makihara, Chihiro ; Yoshida, Katsuyuki (1999) Development of millimeter-wave package for consumer market. In: Gallium Arsenide Applications Symposium. GAAS 1999, 4-5 October 1999, Bologna, Italy.
Full text disponibile come:
[thumbnail of GAAS_99_063.pdf]
Anteprima
Documento PDF
Download (1MB) | Anteprima

Abstract

Semiconductor technology has made significant advancements in the past few decades. High frequency devices, including GaAs, HEMT, and HBT are driven into the market. At the same time, the demand of packages for high frequency devices are accelerating to the market. The movement for package-less by passivation layer is occuring, however because the device yield is poor, high frequency packages are highly demanded. These packages are currently being required for such applications in car radar and wireless LAN programs. This paper will describe the design technologies and material options of micro- to millimeter-wave MMIC package for the consumer market to meet the demands for a small, low cost, and high performance package.

Abstract
Tipologia del documento
Documento relativo ad un convegno o altro evento (Atto)
Autori
AutoreAffiliazioneORCID
Makihara, Chihiro
Yoshida, Katsuyuki
Settori scientifico-disciplinari
DOI
Data di deposito
12 Dic 2005
Ultima modifica
17 Feb 2016 14:28
URI

Altri metadati

Statistica sui download

Statistica sui download

Gestione del documento: Visualizza il documento

^