Flip chip and tab interconnects for millimeter wave MMICs - A comprehensive study

Dravet, Alain ; Desplan, Didier ; Haese, Nathalie ; Rolland, Pierre Alain (1998) Flip chip and tab interconnects for millimeter wave MMICs - A comprehensive study. In: Gallium Arsenide Applications Symposium. GAAS 1998, 5-6 October 1998, Amsterdam, The Netherlands.
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Abstract

This paper presents simulation results performed with a 3D FEM Software on flip chip and tape automated bonding interconnect of MMICs at millimeter wave frequencies (40 - 60 Ghz). Parasitic propagation modes for CPW flip chip mounted MMICs are pointed out with proposed solution. Measurement results obtained with LNA 38 and 55 GHz microstrip MMICs connected to alumina substrates with a 50 Ohm coplanar tape are presented and show goodagreement compared to bare MMICs and to simulations.

Abstract
Document type
Conference or Workshop Item (Paper)
Creators
CreatorsAffiliationORCID
Dravet, Alain
Desplan, Didier
Haese, Nathalie
Rolland, Pierre Alain
Subjects
DOI
Deposit date
16 Feb 2006
Last modified
17 Feb 2016 14:36
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