Abstract

In microwave applications, specific high performance packages have to be designed in order to reduce parasitic reflections, coupling effect... In this paper, the design of a package for microwave applications up to 12 GHz is presented. From the geometry of different leads and dielectric properties, an electromagnetic simulator is used to derive propagation characteristics. Results are discussed in terms of signal degradation, coupling and cross talk. Our analysis points out the stronger limitation of performance due to curved leads especially for high frequencies. The influence of the connection layout in the signal degradation for a transmission through the package and the cross coupling between leads are analyzed.