Abstract

This paper describes theALCATELexperience on the design, manufacturingandmeasurementof microwave and digital modules based on 3D packagingapproach.Even if that appears as a very futuristic approachtoday,thiscould represent a packaging option for the nextspace equipment generation by the years2015-2025.Thisimplies to move from currenthermeticencapsulationofactive devices to advanced technologies suchChip on Board,including glob top encapsulation.The paper thendescribesthe design and manufacture of a low noise amplifiersectionbased on this quasi hermetic packaging option.ThisChip on Board approach is a real candidateforequipmentby the years 2007-2015.