3D packaging for space application : imagination and reality

Monfraix, Philippe ; Drevon, C. ; Schaffauser, Chloé ; Paillard, Mathieu ; Vendier, Olivier ; Cazaux, Jean-Louis (2005) 3D packaging for space application : imagination and reality. In: Gallium Arsenide applications symposium. GAAS 2005, 3-7 ottobre 2005, Parigi.
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Abstract

This paper describes theALCATELexperience on the design, manufacturingandmeasurementof microwave and digital modules based on 3D packagingapproach.Even if that appears as a very futuristic approachtoday,thiscould represent a packaging option for the nextspace equipment generation by the years2015-2025.Thisimplies to move from currenthermeticencapsulationofactive devices to advanced technologies suchChip on Board,including glob top encapsulation.The paper thendescribesthe design and manufacture of a low noise amplifiersectionbased on this quasi hermetic packaging option.ThisChip on Board approach is a real candidateforequipmentby the years 2007-2015.

Abstract
Document type
Conference or Workshop Item (Paper)
Creators
CreatorsAffiliationORCID
Monfraix, Philippe
Drevon, C.
Schaffauser, Chloé
Paillard, Mathieu
Vendier, Olivier
Cazaux, Jean-Louis
Subjects
DOI
Deposit date
16 Feb 2006
Last modified
17 Feb 2016 14:40
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