Design of coplanar power amplifiers for MM-WAVE system applications including thermal aspects

Bessemoulin, A. ; Marsetz, W. ; Baeyens, Y. ; Osorio, R. ; Massler, H. ; Hülsmann, A. ; Schlechtweg, M. (2000) Design of coplanar power amplifiers for MM-WAVE system applications including thermal aspects. In: Gallium Arsenide applications symposium. GAAS 2000, 2-6 october 2000, Paris.
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Abstract

Due to the poor thermal conductivity of GaAs, successful power amplifier design in coplanar technology requires careful thermal considerations. The influences of the active device geometry and mounting conditions have been investigated theoretically and experimentally to provide reliable thermal management design data. 50-µm thinning and flip-chip with thermal bump attachment on AlN or diamond exhibited temperature rises in the order of 50 and 40-30 °C respectively, leading to significant improvement in the performance of coplanar power devices and circuits. These results demonstrate the potential of coplanar MMIC technology for high power applications.

Abstract
Tipologia del documento
Documento relativo ad un convegno o altro evento (Atto)
Autori
AutoreAffiliazioneORCID
Bessemoulin, A.
Marsetz, W.
Baeyens, Y.
Osorio, R.
Massler, H.
Hülsmann, A.
Schlechtweg, M.
Settori scientifico-disciplinari
DOI
Data di deposito
17 Giu 2004
Ultima modifica
17 Feb 2016 13:40
URI

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