Battistella, L. ; Bottini, R. ; Fantini, F. ; Magistrali, F. ; Sala, D. ; Vanzi, M.
(1990)
Field reliability of GaAs emitters for fiber optic telecommunication systems.
In: Gallium Arsenide Applications Symposium. GAAS 1990, 19-20 April 1990, Rome, Italy.
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Abstract
GaAs based emitters are widely used in telecommunication systems, and will be probably the core of short haul communications, even if a lot of doubts still exist on their reliability and the few available field results are not too optimistic. For these reasons we decided to follow with a particular attention all the problems related to these devices, investigating reliability by means of accelerated tests and of an accurate survey of field troubles. In this paper, we first of all report our field data, coming from more than five years experience, which show that "reasonable" results (in the range of 2000 FITs for LDs), can be obtained with commercially available devices; as a second step, failure analysis allows to localize failures,thus understanding the appropriate corrective actions to be taken. highlighting the specific process report also same For chip related failures, detailed examples are reported, different failure mechanisms, that, when not related to defects, are the same found during accelerated tests; we examples of failures due to interconnections and packaging.
Abstract
GaAs based emitters are widely used in telecommunication systems, and will be probably the core of short haul communications, even if a lot of doubts still exist on their reliability and the few available field results are not too optimistic. For these reasons we decided to follow with a particular attention all the problems related to these devices, investigating reliability by means of accelerated tests and of an accurate survey of field troubles. In this paper, we first of all report our field data, coming from more than five years experience, which show that "reasonable" results (in the range of 2000 FITs for LDs), can be obtained with commercially available devices; as a second step, failure analysis allows to localize failures,thus understanding the appropriate corrective actions to be taken. highlighting the specific process report also same For chip related failures, detailed examples are reported, different failure mechanisms, that, when not related to defects, are the same found during accelerated tests; we examples of failures due to interconnections and packaging.
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DOI
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02 Feb 2006
Last modified
17 Feb 2016 14:49
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Document type
Conference or Workshop Item
(Paper)
Creators
Subjects
DOI
Deposit date
02 Feb 2006
Last modified
17 Feb 2016 14:49
URI
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