Ohata, Keiichi
(2000)
Millimeter-wave IC packaging technology-state of the art and future trends.
In: Gallium Arsenide applications symposium. GAAS 2000, 2-6 october 2000, Paris.
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Abstract
This paper presents an overview of recent state of the art technologies and future trends in millimeter-wave MMIC packaging in the aspects of low cost, high productivity and high functionality. Developments of ceramic packages up to W-band have been progressed by design innovation. LTCC Technology with thick film printing has realized low-cost packages and 60GHz-band antenna integrated MCMs. Multi-junctional integrated modules have been proposed utilizing Si micromachining technologies.
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