Design to reliability shielded vertical interconnection applied to microwave Chip Scale Packaging

Monfraix, P. ; Adam, T. ; Lacoste, J.L. ; Drevon, C. ; Naudy, G. ; Cogo, B. ; Cazaux, Jean-Louis ; Roux, J.L. (2000) Design to reliability shielded vertical interconnection applied to microwave Chip Scale Packaging. In: Gallium Arsenide applications symposium. GAAS 2000, 2-6 october 2000, Paris.
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Abstract

This paper presents the electrical design, measurement and reliability ests of a shielded vertical interconnection dedicated to microwave solder-mount packages. Electromagnetic simulations show very good results up to 20 GHz. Test samples have been designed and manufactured. Electrical results are in accordance with the simulations with insertion loss lower than 0.1 dB up to 20 GHz for the proposed interconnection. Reliability tests of present no degradation of the after 500 thermal cycles in the [-55°C, +125°C] temperature range.

Abstract
Tipologia del documento
Documento relativo ad un convegno o altro evento (Atto)
Autori
AutoreAffiliazioneORCID
Monfraix, P.
Adam, T.
Lacoste, J.L.
Drevon, C.
Naudy, G.
Cogo, B.
Cazaux, Jean-Louis
Roux, J.L.
Settori scientifico-disciplinari
DOI
Data di deposito
17 Giu 2004
Ultima modifica
17 Feb 2016 13:44
URI

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