Abstract

Conductive Lithographic Films (CLFs) have previously demonstrated useful properties in printed mi-crowave circuits, combining low cost with high speed of manufacture. In this paper we examine the formation of various passive components via the CLF process, which enables further integration of printed microwave integrated circuits. The printed components include vias, resistors and overlay capacitors, and offer viable alternatives to traditional manufacturing processes for Microwave Inte-grated Circuits (MICs). Manufacturing data, measurements on test structures and equivalent circuit modelling for a range of CLF circuit structures are presented.