Abstract

In this paper, the high volume process (as developed by Aeroflex MIC Technology) for depositing thin films comprising TaN, Ti, Ti/Pd alloy, Cu, Ni, Au (TTPCNA) onto materials such as alumina and aluminium nitride is presented. The benefits of this tested methodology are realized by improved process control, a reduction in cycle time, and minimal operator intervention in the process. These important considerations in today’s competitive manufacturing environment translate into higher yields, reduced cost to the customer and reliability in the field. This high volume line has a current run rate in excess of 24,000 substrates per week as it is presently configured with the ability to expand to 35,000 substrates per week with minimal investment. We then present a case study of the application of this technology, together with the ability to pre-deposit gold-tin solder, in the exacting application of mounting Laser diodes onto thin film heatsinks – which also convey the microwave / millimeter wave signal.