RF System-on-Package (SOP) Development for compact low cost Wireless Front-end systems

Pinel, S. ; Lim, K. ; Maeng, M. ; Davis, M.F. ; Li, R. ; Tentzeris, M. ; Laskar, J. (2002) RF System-on-Package (SOP) Development for compact low cost Wireless Front-end systems. In: Gallium Arsenide applications symposium. GAAS 2002, 23-27 september 2002, Milano.
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Abstract

This paper presents the development of RF System-on-Package (SOP) architectures for compact and low cost wireless radio front -end systems. A novel 3D integration approach for SOP-based solutions for wireless communication applications is proposed and utilized for the implementation of a C band Wireless LAN (WLAN) RF front-end module by means of stacking LTCC substrates using mBGA technology. Results from the characterization and the modeling of RF vertical board -to-board transitions using mBGA process are presented for the first time. LTCC designs of high-performance multilayer embedded bandpass filters and novel stacked cavity-backed patch antennas are also reported. In addition, the fabrication of very high Q-factor inductors and embedded filter in organic substrates demonstrate the satisfactory performance of multilayer organic packages.

Abstract
Document type
Conference or Workshop Item (Paper)
Creators
CreatorsAffiliationORCID
Pinel, S.
Lim, K.
Maeng, M.
Davis, M.F.
Li, R.
Tentzeris, M.
Laskar, J.
Subjects
DOI
Deposit date
17 Jun 2004
Last modified
17 Feb 2016 13:49
URI

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