Morioka, Shigeki ; Yokoi, Kiyotaka ; Yoshida, Katsuyuki ; Shirasaki, Takayuki
(2001)
A DC to 40GHz Low Cost Surface Mountable RF-VIA TM Package.
In: Gallium Arsenide applications symposium. Gaas 2001, 24-28 September 2001, London.
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Abstract
The ultimate goal for low cost packages for millimeterwave MMIC is to realize a miniature, light weight surface mount type package. This paper describes the design technologies of newly developed package, where we optimized via design by multilayer ceramic structure. As a result, insertion loss is about –0.5dB at 40 GHz (measurement include mounting board + one feedthrough) has been realized.
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