GaAs MMIC die assembly

Lautier, P. ; Drevon, C. ; Coello Vera, A. (1992) GaAs MMIC die assembly. In: Gallium Arsenide Applications Symposium. GAAS 1992, 27-29 April 1992, Noordwijk, The Netherlands.
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Abstract

The widespread use of GaAs MMICs in microwave systems require assembly technologies with high yields and high reliability, while preserving the intrinsic performance of the die. This is a difficult task, given the large lateral dimensions and reduced thickness of MMICs, complicated by the presence of via-holes. This paper will present some of the results obtained during assessment of various techniques used for die-attach. These results show that the major reliability concern is the behaviour of the die attach medium within the via-holes. We will present a new process designed to control this behaviour.

Abstract
Tipologia del documento
Documento relativo ad un convegno o altro evento (Atto)
Autori
AutoreAffiliazioneORCID
Lautier, P.
Drevon, C.
Coello Vera, A.
Settori scientifico-disciplinari
DOI
Data di deposito
17 Feb 2006
Ultima modifica
17 Feb 2016 14:46
URI

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