Abstract

This paper reports on the MEMS-IC integration for microwave and millimeterwave applications. The integration is based on the System In Package (SiP) approach achieving high performances and integration density level at microwave and millimeterwave frequencies thanks to the mixing of state-of–the-art technologies both for active (SiGe or RF-MOS technologies) and passive (dielectric based technology) devices/circuits. This concept can also take full benefit of the MEMS technologies to provide various smart functionalities to microsystem. The proposed approach is illustrated through different applications which outline the design issues of such heterogeneous microsystem.