Di Marcantonio, U. ; Di Nardo, I. ; Tursini, M. ; Comparini, M.C. ; Novello, R. ; Leone, C.
(2003)
Integrated Substrate Packaging Based on LTCC and HTCC Technologies for Highly Integrated Space Equipment.
In: Gallium Arsenide applications symposium. GAAS 2003, 6-10 October 2003, Munich.
Full text available as:
Preview |
PDF
Download (22kB) | Preview |
Abstract
non disponibile
Abstract
Other metadata
Downloads
Downloads
Staff only:
