Abstract

This paper presents the development of advanced System-on-Package (SOP)architectures for compact and low cost wireless RF wireless systems. We present the design of compact stacked patch antennas using SHS structures for LMDS and V- band applications.Multi-layer organic packaging development for SOP is reported.An Intelligent Network Communicator (INC)RF block is presented as example of the high performances of multi-layer organic package.A novel ultra-compact 3D integration technology for SOP-based solutions is proposed and utilized for the implementation of a Ku band VCO module.In addition,the fabrication of very high Q- factor inductors in Liquid Crystal Polymer multi-layer substrate demonstrate superior performances compared to any other multilayer organic packages.