System-on-Package (SOP) Architectures for compact and low cost RF Front-end modules

Pinel, S. ; Lim, K. ; DeJean, R.G. ; Li, L. ; Lee, C-H. ; Maeng, M. ; Davis, M.F. ; Tentzeris, M. ; Laskar, J. (2003) System-on-Package (SOP) Architectures for compact and low cost RF Front-end modules. In: Gallium Arsenide applications symposium. GAAS 2003, 6-10 October 2003, Munich.
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Abstract

This paper presents the development of advanced System-on-Package (SOP)architectures for compact and low cost wireless RF wireless systems. We present the design of compact stacked patch antennas using SHS structures for LMDS and V- band applications.Multi-layer organic packaging development for SOP is reported.An Intelligent Network Communicator (INC)RF block is presented as example of the high performances of multi-layer organic package.A novel ultra-compact 3D integration technology for SOP-based solutions is proposed and utilized for the implementation of a Ku band VCO module.In addition,the fabrication of very high Q- factor inductors in Liquid Crystal Polymer multi-layer substrate demonstrate superior performances compared to any other multilayer organic packages.

Abstract
Tipologia del documento
Documento relativo ad un convegno o altro evento (Atto)
Autori
AutoreAffiliazioneORCID
Pinel, S.
Lim, K.
DeJean, R.G.
Li, L.
Lee, C-H.
Maeng, M.
Davis, M.F.
Tentzeris, M.
Laskar, J.
Settori scientifico-disciplinari
DOI
Data di deposito
17 Giu 2004
Ultima modifica
17 Feb 2016 13:56
URI

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