Abstract

In this paper anisotropic conductive pastes (ACP) are proposed for the 1st level interconnect of millimeter-wave multichip modules (MCM) and packages. This 1st level interconnect between components on top of the module and the MCM is established in a flipchip approach. Here, instead of gold based bumps ACP together with a structured dielectric layer are used. The latter features additional chip support and bump shaping capabilities. These flipchip arrangements are experimentally investigated and compared to conventional gold based interconnections up to 110GHz.