From full hybrid to 3D microwave packaging for space applications

Drevon, C. ; Cazaux, Jean-Louis (1999) From full hybrid to 3D microwave packaging for space applications. In: Gallium Arsenide Applications Symposium. GAAS 1999, 4-5 October 1999, Bologna, Italy.

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Abstract

Over recent years, the miniaturisation of microwave functions was based on the use of hybrid technology. That included thin or thick film capability, micro or macro microwave packages and the design of MMICs. In the same time, many developments were running around the MCM technology, first for low frequency applications then for R.F. packaging. The future could be in the 3D technology, wafer scale integration and/or a mix with embedded passive components into Silicon.

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