Thermal analysis of RF-MEMS switches for power handling front-end

Coccetti, F. ; Ducarouge, B. ; Scheid, E. ; Dubuc, D. ; Grenier, K. ; Plana, R. (2005) Thermal analysis of RF-MEMS switches for power handling front-end. In: Gallium Arsenide applications symposium. GAAS 2005, 3-7 ottobre 2005, Parigi.
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Abstract

An experimental setup for the characterization of electromagnetic induced heat onMEMSdevices undertaking high RF power regime (> 5W) ishereproposed.The technique is based on infrared (IR) imaging of on-probe DUT, while it isin working conditions.Themeasured temperature distributions, for different working state of a RF-MEMS switch, are given. The results showthat for a first considered capacitive switch, the most critical working state is the OFF-state (membrane actuated). In this casethe hot-spots temperature reach75.5°C, for a input power of 6.3W at 10GHz. On the other hand, for the same incident power and frequency a maximum rise of only 5°C has been measured forthe ON-state (membrane in the restposition).Temperature mapping results for a second switch design are moreover presented.This steady-state map offers a real time global performance overview of the RF induced phenomena, and represents a very valuable real-time investigation tool for integrated MEMS and RFIC power handling front-end.

Abstract
Document type
Conference or Workshop Item (Paper)
Creators
CreatorsAffiliationORCID
Coccetti, F.
Ducarouge, B.
Scheid, E.
Dubuc, D.
Grenier, K.
Plana, R.
Subjects
DOI
Deposit date
15 Feb 2006
Last modified
17 Feb 2016 14:26
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