Eckert, G. ; Engelhardt, E. ; Eiermann, F.
(1999)
Light-weight, temperature compensated T/R modules for active phased array radar applications.
In: Gallium Arsenide Applications Symposium. GAAS 1999, 4-5 October 1999, Bologna, Italy.
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Abstract
T/R modules are the key components for active phased array radar applications. This paper describes light-weight, temperature compensated T/R modules which have been developed at DaimlerChrysler Aerospace within the last months. The presented T/R modules are characterised by a three dimensional temperature compensation algorithm, light weight, and high efficiency, which are the main features for T/R modules used in space-borne applications. Besides highly sophisticated Gallium Arsenide monolithic microwave integrated circuits (GaAs MMICs), the key components for T/R modules, multilayer alumina (A12O3) substrate technology has been applied to reduce module size and weight. The presented T/R modules are controlled by a highly integrated digital control electronics realised in MCM-D technology, i.e. multi chip module using bare chips on alumina substrate in thinfilm technology, in which the compensation algorithm is contained, and which is able to control two T/R elements independently, each consisting of one Tx and Rx channel. Applying these technologies, small-sized and light-weight duopack T/R modules have been built-up.
Abstract
T/R modules are the key components for active phased array radar applications. This paper describes light-weight, temperature compensated T/R modules which have been developed at DaimlerChrysler Aerospace within the last months. The presented T/R modules are characterised by a three dimensional temperature compensation algorithm, light weight, and high efficiency, which are the main features for T/R modules used in space-borne applications. Besides highly sophisticated Gallium Arsenide monolithic microwave integrated circuits (GaAs MMICs), the key components for T/R modules, multilayer alumina (A12O3) substrate technology has been applied to reduce module size and weight. The presented T/R modules are controlled by a highly integrated digital control electronics realised in MCM-D technology, i.e. multi chip module using bare chips on alumina substrate in thinfilm technology, in which the compensation algorithm is contained, and which is able to control two T/R elements independently, each consisting of one Tx and Rx channel. Applying these technologies, small-sized and light-weight duopack T/R modules have been built-up.
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Documento relativo ad un convegno o altro evento
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Autori
Settori scientifico-disciplinari
DOI
Data di deposito
15 Feb 2006
Ultima modifica
17 Feb 2016 14:27
URI
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Tipologia del documento
Documento relativo ad un convegno o altro evento
(Atto)
Autori
Settori scientifico-disciplinari
DOI
Data di deposito
15 Feb 2006
Ultima modifica
17 Feb 2016 14:27
URI
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