Dubuc, D. ; De Raedt, W. ; Carchon, G. ; Do, M.N. ; Fourn, E. ; Grenier, K. ; Plana, R.
(2005)
MEMS-IC integration for RF and millimeterwave
applications.
In: Gallium Arsenide applications symposium. GAAS 2005, 3-7 ottobre 2005, Parigi.
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Abstract
This paper reports on the MEMS-IC
integration for microwave and millimeterwave
applications. The integration is based on the System In
Package (SiP) approach achieving high performances and
integration density level at microwave and millimeterwave
frequencies thanks to the mixing of state-of–the-art
technologies both for active (SiGe or RF-MOS
technologies) and passive (dielectric based technology)
devices/circuits. This concept can also take full benefit of
the MEMS technologies to provide various smart
functionalities to microsystem. The proposed approach is
illustrated through different applications which outline
the design issues of such heterogeneous microsystem.
Abstract
This paper reports on the MEMS-IC
integration for microwave and millimeterwave
applications. The integration is based on the System In
Package (SiP) approach achieving high performances and
integration density level at microwave and millimeterwave
frequencies thanks to the mixing of state-of–the-art
technologies both for active (SiGe or RF-MOS
technologies) and passive (dielectric based technology)
devices/circuits. This concept can also take full benefit of
the MEMS technologies to provide various smart
functionalities to microsystem. The proposed approach is
illustrated through different applications which outline
the design issues of such heterogeneous microsystem.
Document type
Conference or Workshop Item
(Paper)
Creators
Subjects
DOI
Deposit date
15 Feb 2006
Last modified
17 Feb 2016 14:30
URI
Other metadata
Document type
Conference or Workshop Item
(Paper)
Creators
Subjects
DOI
Deposit date
15 Feb 2006
Last modified
17 Feb 2016 14:30
URI
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