Abstract

The GaAs- and InP-based compound semiconductor technology enables the realization of intelligent sensor systems showing excellent and formerly not achievable performance. Bandgap engineering allows outstanding electrical properties including the use of quantum phenomena. In addition, these material systems offer a simplification of technology with a number of features for micromechanics, such as the etching selectivity. Various microelectro-mechanical systems or sensors can then be easily fabricated combining electronic and mechanical functions on the same chip. The mechanical functions include suspended bridges and membrane structures realized by front and back side processing.