Hartnagel, H.L. ; Arslan, D. ; Brandt, M. ; Dehe, A. ; Mutamba, K. ; Vogt, A.
(1998)
Compound semiconductor microsensors for applications in mechanical engineering.
In: Gallium Arsenide Applications Symposium. GAAS 1998, 5-6 October 1998, Amsterdam, The Netherlands.
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Abstract
The GaAs- and InP-based compound semiconductor technology enables the realization of intelligent sensor systems showing excellent and formerly not achievable performance. Bandgap engineering allows outstanding electrical properties including the use of quantum phenomena. In addition, these material systems offer a simplification of technology with a number of features for micromechanics, such as the etching selectivity. Various microelectro-mechanical systems or sensors can then be easily fabricated combining electronic and mechanical functions on the same chip. The mechanical functions include suspended bridges and membrane structures realized by front and back side processing.
Abstract
The GaAs- and InP-based compound semiconductor technology enables the realization of intelligent sensor systems showing excellent and formerly not achievable performance. Bandgap engineering allows outstanding electrical properties including the use of quantum phenomena. In addition, these material systems offer a simplification of technology with a number of features for micromechanics, such as the etching selectivity. Various microelectro-mechanical systems or sensors can then be easily fabricated combining electronic and mechanical functions on the same chip. The mechanical functions include suspended bridges and membrane structures realized by front and back side processing.
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Conference or Workshop Item
(Paper)
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DOI
Deposit date
16 Feb 2006
Last modified
17 Feb 2016 14:35
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Document type
Conference or Workshop Item
(Paper)
Creators
Subjects
DOI
Deposit date
16 Feb 2006
Last modified
17 Feb 2016 14:35
URI
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