Material characterization and device performance of In0.7Al0.3As/InAs/In0.8Ga0.2As HFET structures fabricated on GaAs

Wang, S. M. ; Karlsson, C. ; Rorsman, N. ; Bergh, M. ; Olsson, E. ; Andersson, T. G. ; Zirath, H. (1996) Material characterization and device performance of In0.7Al0.3As/InAs/In0.8Ga0.2As HFET structures fabricated on GaAs. In: Gallium Arsenide Applications Symposium. GAAS 1996, 5-6 June 1996, Paris, France.
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Abstract

In0.7Al0.3As/InAs/In0.8Ga0.2As modulation-doped heterostructures on GaAs were characterized and HFETs were fabricated. A linearly graded InAlAs buffer was used to transform the lattice constant from that of GaAs to In0.8Ga0.2As Random surface morphology with scattered volcano-like deep holes was observed. The root-mean-square roughness value was 4-7 nm. Most dislocations were confined in the graded buffer and the maximum threading dislocation density in the HFET layers was estimated to be in the order of 106 cm-2. An electron mobility of 1.37.104 cm2/Vs with a carrier density of 1.88.1012 cm-2 at 300 K was achieved. HFETs with a 0.1 um gate length showed an extrinsic transconductance of 750 mS/mm, an extrinsic fT of 90 GHz and an fmax of 225 GHz.

Abstract
Document type
Conference or Workshop Item (Paper)
Creators
CreatorsAffiliationORCID
Wang, S. M.
Karlsson, C.
Rorsman, N.
Bergh, M.
Olsson, E.
Andersson, T. G.
Zirath, H.
Subjects
DOI
Deposit date
16 Feb 2006
Last modified
17 Feb 2016 14:37
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