Wang, S. M. ; Karlsson, C. ; Rorsman, N. ; Bergh, M. ; Olsson, E. ; Andersson, T. G. ; Zirath, H.
(1996)
Material characterization and device performance of In0.7Al0.3As/InAs/In0.8Ga0.2As HFET structures fabricated on GaAs.
In: Gallium Arsenide Applications Symposium. GAAS 1996, 5-6 June 1996, Paris, France.
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Abstract
In0.7Al0.3As/InAs/In0.8Ga0.2As modulation-doped heterostructures on GaAs were characterized and HFETs were fabricated. A linearly graded InAlAs buffer was used to transform the lattice constant from that of GaAs to In0.8Ga0.2As Random surface morphology with scattered volcano-like deep holes was observed. The root-mean-square roughness value was 4-7 nm. Most dislocations were confined in the graded buffer and the maximum threading dislocation density in the HFET layers was estimated to be in the order of 106 cm-2. An electron mobility of 1.37.104 cm2/Vs with a carrier density of 1.88.1012 cm-2 at 300 K was achieved. HFETs with a 0.1 um gate length showed an extrinsic transconductance of 750 mS/mm, an extrinsic fT of 90 GHz and an fmax of 225 GHz.
Abstract
In0.7Al0.3As/InAs/In0.8Ga0.2As modulation-doped heterostructures on GaAs were characterized and HFETs were fabricated. A linearly graded InAlAs buffer was used to transform the lattice constant from that of GaAs to In0.8Ga0.2As Random surface morphology with scattered volcano-like deep holes was observed. The root-mean-square roughness value was 4-7 nm. Most dislocations were confined in the graded buffer and the maximum threading dislocation density in the HFET layers was estimated to be in the order of 106 cm-2. An electron mobility of 1.37.104 cm2/Vs with a carrier density of 1.88.1012 cm-2 at 300 K was achieved. HFETs with a 0.1 um gate length showed an extrinsic transconductance of 750 mS/mm, an extrinsic fT of 90 GHz and an fmax of 225 GHz.
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16 Feb 2006
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17 Feb 2016 14:37
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Document type
Conference or Workshop Item
(Paper)
Creators
Subjects
DOI
Deposit date
16 Feb 2006
Last modified
17 Feb 2016 14:37
URI
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