Brambilla, P. ; Magistrali, F. ; Sangalli, M. ; Canali, C. ; Zanoni, E. ; Castellaneta, G. ; Marchetti, F.
(1990)
Results from electrical caracterization and reliability tests of GaAs/GaAlAs HEMT's.
In: Gallium Arsenide Applications Symposium. GAAS 1990, 19-20 April 1990, Rome, Italy.
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Abstract
GaAs/GaAlAs HEMT's are rapidly replacing conventional FET's for applications where high gain and low noise figure at high frequencies are needed; for this reason we began a qualification program on them, with the goal of evaluating the possible criticalities that could affect long term performances. The program includes electrical characterization, thermal storages and operating life-tests on commercially available devices, coming from four different manufacturers. During the electrical characterization we especially focused on "kink" effect, concluding that it should be ascribed to trapping/detrapping mechanisms in the AlGaAs layer; even if this phenomenon is peculiar of HEMT's, we found no evidence of any possible detrimental effect on reliability. Thermal storage at 250 °C caused Schottky barrier degradation in the devices with Ni or Ti used as interdiffusion barrier between Al and GaAs; these degradations affect devices performances but cannon be considered peculiar of HEMT's technology, as they were found in low noise FET's too. During biased life-test at Tch = 175 °C, no significant parametric degradation was found up to 2500 test hours.
Abstract
GaAs/GaAlAs HEMT's are rapidly replacing conventional FET's for applications where high gain and low noise figure at high frequencies are needed; for this reason we began a qualification program on them, with the goal of evaluating the possible criticalities that could affect long term performances. The program includes electrical characterization, thermal storages and operating life-tests on commercially available devices, coming from four different manufacturers. During the electrical characterization we especially focused on "kink" effect, concluding that it should be ascribed to trapping/detrapping mechanisms in the AlGaAs layer; even if this phenomenon is peculiar of HEMT's, we found no evidence of any possible detrimental effect on reliability. Thermal storage at 250 °C caused Schottky barrier degradation in the devices with Ni or Ti used as interdiffusion barrier between Al and GaAs; these degradations affect devices performances but cannon be considered peculiar of HEMT's technology, as they were found in low noise FET's too. During biased life-test at Tch = 175 °C, no significant parametric degradation was found up to 2500 test hours.
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Documento relativo ad un convegno o altro evento
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Autori
Settori scientifico-disciplinari
DOI
Data di deposito
02 Feb 2006
Ultima modifica
17 Feb 2016 14:49
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Tipologia del documento
Documento relativo ad un convegno o altro evento
(Atto)
Autori
Settori scientifico-disciplinari
DOI
Data di deposito
02 Feb 2006
Ultima modifica
17 Feb 2016 14:49
URI
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