Flip-chip for space applications : Bonding reliability, DC and RF results.

George, Sebastien ; Drevon, C. ; Cazaux, Jean-Louis (2000) Flip-chip for space applications : Bonding reliability, DC and RF results. In: Gallium Arsenide applications symposium. GAAS 2000, 2-6 october 2000, Paris.
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Abstract

This paper presents a study of flip-chip bonding for space applications. DC and mechanical test vehicles have demonstrated the reliability of the flip-chip gold-gold thermocompression bonding up to 500 thermal cycles. RF test vehicles have proved the compatibility of both coplanar and microstrip on-the-shelves MMICs with the flip-chip bonding up to 35 GHz.

Abstract
Document type
Conference or Workshop Item (Paper)
Creators
CreatorsAffiliationORCID
George, Sebastien
Drevon, C.
Cazaux, Jean-Louis
Subjects
DOI
Deposit date
17 Jun 2004
Last modified
17 Feb 2016 13:44
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