Trovarello, Simone ; Masotti, Diego ; Aldrigo, Martino ; Modreanu, Mircea ; Costanzo, Alessandra
(2021)
Design of a 24-GHz dual-polarized rectenna
integrated on silicon.
[Preprint]
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Abstract
This paper presents the design of an integrated and differential rectenna on silicon, operating at 24 GHz. The
antenna is dual-polarized and composed by four patches on a
synthetized low effective permittivity dielectric. The substrate is a structure composed of three layers of high-resistivity silicon (εr = 11.9) where the central layer has an air cavity equal to the dimensions of the antennas. The feeding solution is performed by planar microstrip lines with inset feeds. A shunt configuration was chosen for the rectifier with GaAs diodes. The silicon substrate assures the complete integration for on-chip systems and despite the lossy material chosen as substrate, each patch antenna presents 83% of radiation efficiency with a maximum gain of 4.82 dBi. The overall efficiency of the rectenna is 44% at a
received power level of 10 dBm.
Abstract
This paper presents the design of an integrated and differential rectenna on silicon, operating at 24 GHz. The
antenna is dual-polarized and composed by four patches on a
synthetized low effective permittivity dielectric. The substrate is a structure composed of three layers of high-resistivity silicon (εr = 11.9) where the central layer has an air cavity equal to the dimensions of the antennas. The feeding solution is performed by planar microstrip lines with inset feeds. A shunt configuration was chosen for the rectifier with GaAs diodes. The silicon substrate assures the complete integration for on-chip systems and despite the lossy material chosen as substrate, each patch antenna presents 83% of radiation efficiency with a maximum gain of 4.82 dBi. The overall efficiency of the rectenna is 44% at a
received power level of 10 dBm.
Tipologia del documento
Preprint
Autori
Parole chiave
Rectennas, silicon integration, system on a chip,
millimeter waves
Settori scientifico-disciplinari
DOI
Data di deposito
30 Giu 2021 06:42
Ultima modifica
27 Lug 2021 10:03
Nome del Progetto
Programma di finanziamento
EC - H2020
URI
Altri metadati
Tipologia del documento
Preprint
Autori
Parole chiave
Rectennas, silicon integration, system on a chip,
millimeter waves
Settori scientifico-disciplinari
DOI
Data di deposito
30 Giu 2021 06:42
Ultima modifica
27 Lug 2021 10:03
Nome del Progetto
Programma di finanziamento
EC - H2020
URI
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