Silicon Packaging and RF Solder-free Interconnect for X-band SAR T/R Module

Saint-Etienne, Eric ; Reig, Bruno ; Deborgies, F. ; Ghesquiers, Jean-Pierre ; Roques, Daniel ; Le Meur, Gerard ; Cogo, B. ; Mancuso, Yves (2001) Silicon Packaging and RF Solder-free Interconnect for X-band SAR T/R Module. In: Gallium Arsenide applications symposium. Gaas 2001, 24-28 September 2001, London.

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Abstract

This paper presents recent development conducted in the area of RF packaging and interconnect technologies. An original concept of 3D silicon packaging including collective wiring process is proposed and applied to the design of an X-band T/R module demonstrator. An RF solder-less interconnect based on the CIN::APSE connecting system (CINCH TM) has been developed to address the need of vertical transition in new generation of SAR active antenna.

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