Anisotropic Conductive Adhesives for Millimeterwave Flipchip Interconnections

Heyen, Johann ; Jacob, Arne F. (2004) Anisotropic Conductive Adhesives for Millimeterwave Flipchip Interconnections. In: Gallium Arsenide applications symposium. GAAS 2004, 11—12 Ottobre, Amsterdam.
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Abstract

In this paper anisotropic conductive pastes (ACP) are proposed for the 1st level interconnect of millimeter-wave multichip modules (MCM) and packages. This 1st level interconnect between components on top of the module and the MCM is established in a flipchip approach. Here, instead of gold based bumps ACP together with a structured dielectric layer are used. The latter features additional chip support and bump shaping capabilities. These flipchip arrangements are experimentally investigated and compared to conventional gold based interconnections up to 110GHz.

Abstract
Tipologia del documento
Documento relativo ad un convegno o altro evento (Atto)
Autori
AutoreAffiliazioneORCID
Heyen, Johann
Jacob, Arne F.
Settori scientifico-disciplinari
DOI
Data di deposito
07 Giu 2005
Ultima modifica
17 Feb 2016 14:08
URI

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