Abstract

This paper presents the design and performance of a compact 1-Watt Ku-band power amplifier MMIC implemented in a novel microwave organic power package, compatible with SMD assembly lines. Due to the use of simple materials, like RO4003 substrate and copper, it allows significant cost reduction for RF module assembly. The packaged amplifier MMIC demonstrates as well, very high-gain, as high as 32 dB at Ku-band, under very stable conditions, and more than 1.25-Watt continuous-wave output power (>31 dBm).