Shirokov, Mikhail S. ; Gray, Eric S. ; Little, Duncan A. ; Hau, Gary ; James, A. ; Roche, Jr.
(2004)
Low-Cost Wide-Range Low-Current Consumption
Linear HBT MMIC Power Amplifier for Portable
2.4GHz WLAN Applications.
In: Gallium Arsenide applications symposium. GAAS 2004, 11—12 Ottobre, Amsterdam.
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Abstract
A low-cost, low-current consumption 2.4-
2.5GHz MMIC power amplifier operating at 3.3V single
supply has been developed for high data rate, wide-range
portable WLAN applications. The MMIC utilizes a
Fairchild-proprietary InGaP HBT process that enables the
design of high power density and extremely linear circuits
at frequencies exceeding 6GHz. The MMIC design has been
constructed based on accurate HBT and passives models,
focusing on performance optimization for low AM-AM and
AM-PM distortion, low current consumption and minimal
harmonic levels. For an OFDM modulated signal at 54Mbps
data rate, the PA delivers +23.6 dBm linear output at a
corresponding Error Vector Magnitude (EVM) of 4.4%(-27dB), while consuming an average packet current of less
that 315mA. The MMIC is fully matched in a cost-effective
3x3mm QFN package, requiring only a small number of
external passive components for efficient board layout and
low total cost.
Abstract
A low-cost, low-current consumption 2.4-
2.5GHz MMIC power amplifier operating at 3.3V single
supply has been developed for high data rate, wide-range
portable WLAN applications. The MMIC utilizes a
Fairchild-proprietary InGaP HBT process that enables the
design of high power density and extremely linear circuits
at frequencies exceeding 6GHz. The MMIC design has been
constructed based on accurate HBT and passives models,
focusing on performance optimization for low AM-AM and
AM-PM distortion, low current consumption and minimal
harmonic levels. For an OFDM modulated signal at 54Mbps
data rate, the PA delivers +23.6 dBm linear output at a
corresponding Error Vector Magnitude (EVM) of 4.4%(-27dB), while consuming an average packet current of less
that 315mA. The MMIC is fully matched in a cost-effective
3x3mm QFN package, requiring only a small number of
external passive components for efficient board layout and
low total cost.
Document type
Conference or Workshop Item
(Paper)
Creators
Subjects
DOI
Deposit date
15 Jun 2005
Last modified
17 Feb 2016 14:10
URI
Other metadata
Document type
Conference or Workshop Item
(Paper)
Creators
Subjects
DOI
Deposit date
15 Jun 2005
Last modified
17 Feb 2016 14:10
URI
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